I36DUA Intel LGA1366 Solution
Excellent thermal performance and ultra silent 1.99.97% pure copper and heat pipe technology provides high thermal
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Optimal fin ratio and fan combination provide a cost-effective solution with good thermal performance.


High thermal conduction design


High performance micro-silver powder grease.


Aluminum extrusion and insertion technology.


Screw spring foot design for easy installation.


Using PWM control method to adjust fan speed.


No system environment temperature restriction.


Superb cooling when a fan is used
Extremely quiet even using a fan.


Easy to install


Aluminum Extrusion Heatsink provides more heat dissipation area.


The purpose of the company's quality, service, security, trust is our company's product demand.


Smart Airflow Design


Application :  Intel® Core™ i5 Processor all series


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We guarantee our excellent raw material & high quality control, competitive price and complete service after sale. We also guarantee excellent product quality, strong packing system, reasonable price and on-time shipments.



ThermalFly Office committed to using lighter weight materials, lower noise and lower manufacturing cost to deliver superior cooling solutions. The result is increased value for our customers with lighter system board loading, quiet working environment and optimal price performance. Price performance, weight performance, and noise performance are our cooling design philosophy.



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